100M SFP MFEBX1 20km 1310nm-TX/1550nm-RX Simplex LC/UPC Module, Cisco

The 100M SFP MFEBX1 20km 1310nm-TX/1550nm-RX Simplex LC/UPC Module, Cisco is a hot-pluggable SFP transceiver rated at 155Mbps. Using a Simplex LC optical interface over SMF at 1310nm-TX/1550nm-RX, it covers transmission distances up to 20km. Compliance with Fast Ethernet, Gigabit Fibre Channel, MSA Compliant, together with integrated diagnostic monitoring, makes it a dependable choice for enterprise access, campus, telecom edge and industrial network environments.

Product Highlights

• SFP form factor, 155Mbps data rate
• Wavelength: 1310nm-TX/1550nm-RX
• Connector: Simplex LC
• Reach: up to 20km
• Fiber media: SMF
• Operating temperature: 0 to 70°C (32 to 158°F)

Built for enterprise access, campus, telecom edge and industrial network environments, this SFP module carries 155Mbps over SMF up to 20km per link. The Simplex LC interface and 1310nm-TX/1550nm-RX optics match the standard cabling plant used in modern data halls, so existing trunks can be reused. It is interoperable with Cisco platforms and replaces the Cisco part MFEBX1 directly.

On the compatibility side, this unit is the practical equivalent of the Cisco part MFEBX1 and works in Cisco systems out of the box. Standards compliance covers Fast Ethernet, Gigabit Fibre Channel, MSA Compliant.

Order this product as SFP-FE35-BX20. Common models are stocked for fast dispatch. We can supply the module with neutral or customer-branded labels, and compatibility coding for a specific equipment vendor can be added at no extra process step.

Most orders travel by international express and arrive within days; palletized freight by air or sea is used for volume orders. If you prefer, we ship on your DHL, UPS or FedEx account, or deliver to your appointed agent in China for onward consolidation.

From incoming component inspection to final burn-in, quality is controlled at each step of production. Finished units are verified on real networking equipment in our compatibility lab, and test records are kept per batch so that any field question can be traced back quickly.

Products are first packed into blister trays or self-sealed bags and then into cartons. Standard labels and marks are applied by default, and customized packing and labeling are available on request.

Our product line has grown with the industry for three decades, from GBIC-era modules to today's 800G and 1.6T interconnects. If the exact configuration you need is not listed, we can usually build it: custom lengths, mixed connector breakouts, OEM branding and project-specific firmware coding are all supported.