100G QSFP56 SR2 2x 50G PAM4 850nm 100m MPO-12/UPC InfiniBand EDR, NVIDIA (IB)

Designed for 100G Ethernet data center and enterprise network environments, the 100G QSFP56 SR2 2x 50G PAM4 850nm 100m MPO-12/UPC InfiniBand EDR, NVIDIA (IB) provides 106.25 Gbps throughput in a QSFP56 form factor. It operates at 850nm over MMF through a MPO-12/UPC connector and supports link lengths up to 100m. The module meets QSFP56 MSA, SFF-8636, IEEE 802.3cd and includes digital diagnostic monitoring for live status readout.

Product Highlights

• QSFP56 form factor, 106.25 Gbps data rate
• Wavelength: 850nm
• Connector: MPO-12/UPC
• Reach: up to 100m
• Fiber media: MMF
• DDM/DOM: Supported

The 100G QSFP56 SR2 2x 50G PAM4 850nm 100m MPO-12/UPC InfiniBand EDR, NVIDIA (IB) is used in 100G Ethernet data center and enterprise network environments, where it provides a 106.25 Gbps link over MMF up to 100m. With its MPO-12/UPC optical interface, the module works directly with the MMF infrastructure already installed in most facilities. Custom labeling, packaging and compatibility coding for specific equipment vendors are available from our factory on request.

Compliance: QSFP56 MSA, SFF-8636, IEEE 802.3cd. Every unit's EEPROM coding and link behavior are verified on real host equipment in our lab, so what arrives at your site is ready to use.

To order, quote QSFP56-SR2-100G together with your quantity. Stock items ship quickly; for OEM orders we support custom labels, retail packing and vendor-specific coding, all handled in our own factory.

Our warehouse keeps fast-moving transceivers and cables ready for same-week dispatch. Courier, air freight and sea freight options are all available depending on your budget and schedule, and we consolidate multiple items into one shipment whenever it saves you cost.

Before any product leaves our factory it goes through optical performance testing, compatibility verification on real switch platforms and a final visual inspection. Our in-house test lab holds a wide range of current and legacy switches from major brands, so interoperability is proven on the actual equipment your network uses rather than assumed from paper specifications.

Products are first packed into blister trays or self-sealed bags and then into cartons. Standard labels and marks are applied by default, and customized packing and labeling are available on request.

Our product line has grown with the industry for three decades, from GBIC-era modules to today's 800G and 1.6T interconnects. If the exact configuration you need is not listed, we can usually build it: custom lengths, mixed connector breakouts, OEM branding and project-specific firmware coding are all supported.