
Designed for InfiniBand NDR fabrics, GPU clusters and AI training networks, the 800G OSFP XDR8 B2 Optical Transceiver provides 850Gbps (8x 106.25Gbps) throughput in a Twin-port OSFP IHS/Closed Finned Top form factor. It operates at 1310nm over SMF through a Dual MPO-12/APC connector and supports link lengths up to 2km. The module meets IEEE 802.3ck, IEEE 802.3cu-2021, OSFP MSA, CMIS Rev 5.0 and includes digital diagnostic monitoring for live status readout.
| Part Number | OSFP800-XDR8-B2 |
|---|---|
| Manufacturer | HT |
| Form Factor | Twin-port OSFP IHS/Closed Finned Top |
| Max Data Rate | 850Gbps (8x 106.25Gbps) |
| Wavelength | 1310nm |
| Max Cable Distance | 2km |
| Connector | Dual MPO-12/APC |
| Media | SMF |
| Transmitter Type | EML |
| Receiver Type | Siphotonics PIN |
| TX Power | -3.1~4dBm |
| Minimum Receiver Power | -7.1dBm |
| Power Budget | 4dB |
| Receiver Overload | 4dBm |
| Max Power Consumption | 16.5W |
| Extinction Ratio | >3.5dB |
| DDM/DOM | Supported |
| Commercial Temperature Range | 0 to 70°C (32 to 158°F) |
| Modulation (Electrical) | 8x100G-PAM4 |
| Modulation (Optical) | Dual 4x100G-PAM4 |
| CDR (Clock and Data Recovery) | TX and RX Built-in DSP |
| Packaging Technology | COB (Chip on Board) Packaging |
| Bit Error Ratio (BER) | 2.4E-4 |
| MTBF | 3,222,983 Hours (@40°C, 60% CL) 1,632,641 Hours (@40°C, 90% CL) |
| Protocols | IEEE 802.3ck, IEEE 802.3cu-2021, OSFP MSA, CMIS Rev 5.0 |
Built for InfiniBand NDR fabrics, GPU clusters and AI training networks, this Twin-port OSFP IHS/Closed Finned Top module carries 850Gbps (8x 106.25Gbps) over SMF up to 2km per link. The Dual MPO-12/APC interface and 1310nm optics match the standard cabling plant used in modern data halls, so existing trunks can be reused. Custom labeling, packaging and compatibility coding for specific equipment vendors are available from our factory on request.
Compliance: IEEE 802.3ck, IEEE 802.3cu-2021, OSFP MSA, CMIS Rev 5.0. Every unit's EEPROM coding and link behavior are verified on real host equipment in our lab, so what arrives at your site is ready to use.
Our part number for this module is OSFP800-XDR8-B2. When ordering, just let us know the quantity and whether you need the compatibility coding for a particular switch brand; labeling and packaging can also follow your channel requirements.
Before any product leaves our factory it goes through optical performance testing, compatibility verification on real switch platforms and a final visual inspection. Our in-house test lab holds a wide range of current and legacy switches from major brands, so interoperability is proven on the actual equipment your network uses rather than assumed from paper specifications.
Default packaging is simple and protective: sealed bag, blister tray, export carton. For OEM customers we also offer white-label packing, custom printed boxes and per-unit labeling with your own part numbers, so the goods can go straight into your sales channel.
Our product line has grown with the industry for three decades, from GBIC-era modules to today's 800G and 1.6T interconnects. If the exact configuration you need is not listed, we can usually build it: custom lengths, mixed connector breakouts, OEM branding and project-specific firmware coding are all supported.
We ship to customers around the world every week. Express couriers handle most orders door to door in a few days; larger consignments go by air or sea to keep freight costs down. Tracking information is provided for every shipment, and we are flexible on shipping accounts and forwarders.