1.6T OSFP224 PCxxx Passive DAC

The 1.6T OSFP224 PCxxx Passive DAC is a passive dac direct attach copper cable with OSFP (IHS Finned Top) to OSFP (IHS Finned Top), supporting 1600Gbps links over a length of 0.5~1m (2~3ft). As a passive cable it draws essentially no power and adds no latency to the link. It is a cost effective, low latency interconnect for next generation InfiniBand XDR fabrics and large scale AI clusters, and complies with OSFP MSA, IEEE 802.3.

Product Highlights

• OSFP (IHS Finned Top) to OSFP (IHS Finned Top)
• Data rate: 1600Gbps
• Cable type: Passive DAC
• Length: 0.5~1m (2~3ft)
• Operating temperature: 0 to 70°C (32 to 158°F)

The 1.6T OSFP224 PCxxx Passive DAC connects OSFP (IHS Finned Top) to OSFP (IHS Finned Top) ports at 1600Gbps in next generation InfiniBand XDR fabrics and large scale AI clusters. This unit is supplied at 0.5~1m (2~3ft). It installs directly into standard ports with no separate transceivers or patch cords to manage at either end. If your project needs a specific vendor coding or custom label, our production line handles it as a routine step before packing. The link runs 8x 200G-PAM4 modulation, which keeps it aligned with current 1.6T switch silicon.

This product is designed and tested to comply with OSFP MSA, IEEE 802.3. It plugs into any standards-based OSFP (IHS Finned Top) to OSFP (IHS Finned Top) port, and compatibility coding for specific switch or router brands can be done in our factory before shipment.

This model is supplied at 0.5~1m (2~3ft) under part number OSFP-1.6T-PCxxx. Other lengths of the same assembly can be produced on request. Wire gauge: 26AWG. Volume pricing is available for project quantities.

Standard products are held in stock and usually ship within one to three working days. We dispatch worldwide by DHL, UPS, FedEx, TNT or EMS, and for bulk orders we arrange air or sea freight. Shipments can also be sent collect on your own courier account or delivered to your freight forwarder.

From incoming component inspection to final burn-in, quality is controlled at each step of production. Finished units are verified on real networking equipment in our compatibility lab, and test records are kept per batch so that any field question can be traced back quickly.

Products are first packed into blister trays or self-sealed bags and then into cartons. Standard labels and marks are applied by default, and customized packing and labeling are available on request.

Our product line has grown with the industry for three decades, from GBIC-era modules to today's 800G and 1.6T interconnects. If the exact configuration you need is not listed, we can usually build it: custom lengths, mixed connector breakouts, OEM branding and project-specific firmware coding are all supported.